AMD RDNA 3 performance and architecture details hinted during FAD 2022

pcinvasion.com:

At Financial Analyst Day summer 2022, AMD confirmed some new details regarding its upcoming RDNA 3 architecture that will feature in Radeon 7000 Series GPUs later this year. Some of the information was reconfirmed from estimates outlined in prior years, but it also confirmed some prior leaks were true. Thanks to this, we can further hone in on what to expect for gaming performance out of next generation of graphics card.

One promising statistic is that RDNA 3 will apparently offer another >50% performance-per-watt increase over the existing RDNA 2 architecture featured in today’s Radeon RX 6000 Series. This was similarly the case in the move from RDNA 1 to RDNA 2.

Additionally, AMD announced that RDNA 3 GPUs will be manufactured on the more advanced TSMC 5nm manufacturing process, which will allow for more performance or efficiency, based on AMD’s design preferences. This will mark a transition from the TSMC 7nm node that was widely used for RDNA 2.

One thing to keep in mind though is that AMD did not specify how it measured the performance-per-watt efficiency increases, and didn’t provide actual performance estimates. It also did not specify how much the node advantage contributed to the statistic versus the architectural changes alone. Either way, the minimum 50% performance-per-watt improvement is worth getting excited about.

(Image credit: AMD).

Confirmation of the chiplet packaging technique is the other major takeaway from this announcement. We’ve been expecting this for some time due to several leaks that pointed at this. The first mention of using chiplets for RDNA 3 came in Spring 2021 from a serial industry leaker. The second came in February earlier this year from an AMD engineer, who shared a little too much