AMD RDNA 3 GPU tech accidentally leaked by engineer, and it sounds powerful

pcinvasion.com:

While many wishful gamers are still waiting to knab a current generation graphics card, there may be a silver lining to the ongoing shortages. Details about the next generation of graphics cards from AMD are beginning to emerge, and the performance outlook is promising. Just recently, VideoCardz published a screenshot of an AMD engineer’s LinkedIn profile that mentions alleged specs on next-gen AMD RDNA 3 GPU designs, and it hints that large generational performance gains are coming. Again.

There have been rumors circulating for a while now about AMD introducing multi-chip module (MCM) designs for its RDNA 3-based GPU designs. The project listing on the AMD engineer’s profile seems to confirm the tech will indeed be ready. For those unfamiliar, MCM GPUs have huge potential, as the tech will allow chip designers to piece together multiple chiplets for a packaged product with significantly better specs than would be possible on a traditional monolithic (single chip) GPU. One of the holdbacks for many years has been with figuring out a way for multiple chips to communicate without introducing significant amounts of latency, among other issues.

As you can imagine, this made multi-die GPUs impractical for gaming applications for years. It’s no secret that gamers prefer minimal latency.

While AMD hasn’t committed to anything official yet, previous leaks in combination with this project listing make it possible to draw some conclusions about what’s coming. According to the information, the Navi31 and Navi32 GPU designs will feature both 5nm and 6nm design aspects. A die featuring two separate manufacturing nodes is connotative of an MCM design. And there are additional chip size, power efficiency, and performance benefits to